Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
The new silicon-on-polymer chip, which merges silicon and 3D-printing technologies, has more memory than any other flexible chip. Researchers at the Air Force Research Laboratory (AFRI) and American ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback