Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
The new silicon-on-polymer chip, which merges silicon and 3D-printing technologies, has more memory than any other flexible chip. Researchers at the Air Force Research Laboratory (AFRI) and American ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback