Interesting Engineering on MSN
China’s breakthrough in 3rd-gen semiconductor could advance military weapons
Chinese researchers have discovered the leading cause of defects in the promising semiconductor material gallium nitride (GaN ...
ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...
An article recently made available on Engineering delves into silicon carbide (SiC)-based pressure sensors. A comprehensive review paper titled “Pressure Sensors Based on the Third-generation ...
With the rapid expansion of the global medical devices market, the field of medical power supplies is undergoing technological innovations focusing on third-generation semiconductor materials. This ...
A world-first N-polar GaN wafer created by Chinese scientists is set to be a game changer for the semiconductor industry A breakthrough in next-generation semiconductor technology has been announced ...
- Paper Presented at 14th IEEE CPMT Symposium Japan (ICSJ 2025) - TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as ...
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