Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

Packaging often stands as the first physical point of contact between a brand and its audience. While often overlooked or treated as an afterthought, package design reflects a brand’s attention to ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

If consumers cannot find what you are selling in an overwhelming in-store environment, then you have already lost the battle. Many of us buy things that we may or may not need based on the packaging, ...