Vitrealab GmbH, a Vienna-based developer of photonic integrated circuits (PICs) for laser–LCoS-based AR light engines, has ...

Wolfspeed says its 300mm platform will unify high-volume SiC manufacturing for power electronics with advanced capabilities ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

ChipX Global, a compound semiconductor startup founded in 2023 and headquartered in in Dublin, is said to be going to build an 8” fab in Malaysia.

SEOUL, South Korea, Nov. 12, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it is accelerating the development of SiC (Silicon Carbide)-based compound power ...

(Reuters) - The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.

Seoul National University's College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...

IBM (NYSE: IBM) and the University of Dayton today announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to ...

To strengthen academic exchange and collaboration between Taiwan and Japan, the renowned Japanese research institute RIKEN has signed a memorandum of understanding (MoU) with Taiwan's National Science ...

Malaysia stands at a pivotal moment. A crucial player in the global outsourced semiconductor assembly and test (OSAT) landscape, the nation now eyes transforming into a comprehensive semiconductor hub ...