EDN

Common packaging and PCB issues for SoCs

The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...
Digi Times

Chinese PCB firms quietly advance next-gen CoWoP packaging

A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks for copper-clad ...
Digi Times

Ta Liang PCB and advanced packaging orders surge, equipment lead times hit 6 months

PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity, driving demand ...
Design-Reuse

Cadence Acquires Sigrity, a Leader in High-Speed PCB and IC Packaging Analysis

SAN JOSE, Calif., 02 Jul 2012-- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it has acquired Sigrity, Inc., a leading signal and power ...
EDN

Chip design converges with packaging and PCB in SoC era

The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...
Electronic Design

Retainer Houses ML414 Micro Batteries

Groomed for high density PCB packaging, the company’s latest surface-mount retainer accepts all ML414 micro lithium batteries from all major manufacturers and is compatible with all soldering and ...
Machine Design

Screw-terminal binding post

A new miniature, screw-terminaltype binding post handles 22 to 15-awg wire and high-density PCB packaging A new miniature, screw-terminaltype binding post handles 22 to 15-awg wire and high-density ...