The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Professor Jie Gu and members of his Very Large-Scale Integration Lab team presented three papers and a live demonstration on brain-machine-interface at the premier 2024 IEEE International Solid-State ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...