ASE Inc. is launching solder bumping technology for 300mm wafers. The Santa Clara, Calif., supplier of semiconductor packaging and testing services will bump, sort, saw, and die attach the wafers ...

In packaging applications for cellular electronics devices, the use of flip chip copper pillar bumps has been expanding due to its better shape, lesser thickness, smaller form factor, better ...

Figure 1. (A) The solder bumps are visualized for feature localization and exterior analysis. (B) After void segmentation, the voids may be assigned a unique color (label) depending on the bump within ...

As microelectronics manufacturers take efforts for reduction or elimination of Pb from their device packages, characterization of the mechanical properties of different Pb-free solder alloys has ...

Co announces that Chipbond Technology, one of the world's largest merchant gold-bump foundries, has ordered Ultratech's Unity AP300 advanced-packaging lithography tool. Building on the successful ...

In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...