Kaltra is proud to announce the release of the next-generation MCHEdesign, now fully integrated with its online coil selection and simulation platform MCHEselect. This major update delivers instant ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...
It is fairly common to have a hotter than desired component on a PCB. Often, the way to control the heat from such a component is to (a) create a copper pad underneath it as solid as possible, and ...
Thermal Conduction is a “hot” topic! Dr. Rob and the Crew explore how thermal energy is transferred and conserved in different environments. STEM Challenge: Making Thermal Oobleck Curious About ...
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