Semiconductor Engineering

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

New method uses spin motion to control heat flow in magnetic materials

NIMS, in joint research with the University of Tokyo, AIST, the University of Osaka, and Tohoku University, have proposed a ...

Kaltra Launches Next-Gen MCHEdesign With Full Integration Into MCHEselect -- Instant Simulation & Seamless Microchannel Coil Workflow

Kaltra is proud to announce the release of the next-generation MCHEdesign, now fully integrated with its online coil selection and simulation platform MCHEselect. This major update delivers instant ...
PBS

Thermal Conduction

Thermal Conduction is a “hot” topic! Dr. Rob and the Crew explore how thermal energy is transferred and conserved in different environments. STEM Challenge: Making Thermal Oobleck Curious About ...