Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...

San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

The solar industry has dragged its heels on the issue of silver-dependence for cell metallization, but China’s Jiangsu Xianghuan Technology (JXTC) is moving into commercial production with a copper ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

Improvements in the deposition of copper will usher in new ultralarge-scale ICs. Copper has become the material of choice for fabricating connections on ultralarge scale integrated circuits. The ...

Researchers at the University of New South Wales have used a 1 µm copper plating layer on the front silver grid of a TOPCon solar cell to create a protective barrier that reportedly reduces corrosion ...