Upshur is CEO and founder of Mobius Materials, a woman-led Virginia-based startup building the first authenticated secondary ...
STOCKHOLM, SWEDEN – Mycronic’s Global Technologies division has acquired ETZ, a Germany-based manufacturer of test probes used in electrical testing of bare printed circuit boards.
TrendForce also expects higher memory costs to weigh on upstream components. Total notebook panel shipments are projected to fall 7.9% year over year in 2026, with LCD panels facing sharper declines.
Reuters reports that the AI (artificial intelligence) frenzy is creating a major shortage of memory chips, used in everything from consumer electronics and industrial equipment to computers and even ...
AI investment shows no signs of slowing, prompting concern about what happens when it eventually does.
Having led different-sized sales forces over the years, I’ve made some massive hiring mistakes. This isn’t a “how to avoid all hiring mistakes” piece; everyone will make hiring errors over a long and ...
Many years ago, in The Dark Knight, Batman’s nemesis the Joker famously observed that nobody panics when things go “according to plan – even if the plan is horrifying.” It’s when the unexpected ...
PCBsync's enhanced electronic manufacturing service offering encompasses the complete product lifecycle. The company's PCB assembly services now integrate seamlessly with design support, material ...
Magic Leap today announced it has signed an agreement with Pegatron, a leading global electronics manufacturer, to collaborate on the production of augmented reality (AR) glasses components. Under the ...
Dave Murrin is an accomplished sales professional with 40 years of sales experience in the electronics industry. Dave’s approach is solutions-oriented, which has benefited customers in high-tech, ...
Sascha’s appointment marks another milestone as Neways expands its role within the European defense ecosystem. With demand rising and new business accelerating, Neways is investing in a more ...
Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco ...