Beyond heterogenous integration at the system level, or decoupling memory at chip level where separate CMOS and core array are enabled by advanced packaging techniques (Fig. 28), the “next …
IEEE IEDM 2025 | 28 | EDT | Monolithic 3D and Novel Device ...
Dec 6, 2010 · This session highlights cutting-edge device and system innovations for computing beyond Moore’s law, focusing on 2D semiconductors, monolithic 3D integration, novel memories, and …
30-1 | Harnessing the Power of HPC and AI for Beyond-CMOS ...
Dec 6, 2010 · Emerging beyond-CMOS devices demand multiphysics simulation that tightly couples electrostatics, quantum/charge‑spin transport, and ferroic dynamics to predict performance and …
31 | Focus Session | Beyond Von Neumann, from Physics ...
Dec 6, 2010 · 31 | Focus Session | Beyond Von Neumann, from Physics-inspired Solvers to Quantum Hardware Implementation Originally Aired - Wednesday, December 10 Continental 4 Create or Log …
24 | MS | Beyond CMOS and Advanced Transport Model
Dec 6, 2010 · This session includes 6 papers that describe advances in the area of beyond CMOS and advanced transport models. The first paper, by Vandwalle from X-FAB, describes an enhanced drift …
40-7 | Beyond ΔVth: Unlock New Insights into Hydrogen-Induced ...
Dec 6, 2010 · Moving beyond conventional 𝑉th analysis, we unveil, for the first time, the dynamic changes in transconductance (Gm) and contact resistance (RC) during stress, highlighting their dependence …
SC2-4 | High-Density 3D Flash Memory in the CMOS Directly ...
Dec 6, 2010 · SC2-4 | High-Density 3D Flash Memory in the CMOS Directly Bonded to Array (CBA) Era and Beyond Originally Aired - Sunday, December 7 Continental Ballroom 6-9